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      <title>Nature子刊—热界面材料的革命：从被动填充到集成化发展之路</title>
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      <description><![CDATA[来源：nature electronics链接：https://doi.org/10.1038/s41928-025-01543-7 P
01 背景介绍


[*]行业趋势：电子技术呈现微型化、高功率密度、高性能需求三大趋势，传统硅技术逼近物理极限，散热成为制约系统性能、可靠性和扩展性的首要因素。
[*]TIMs 定义与定位：热 ...]]></description>
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      <author>bjtuzhangwei</author>
      <pubDate>Thu, 08 Jan 2026 08:04:48 +0000</pubDate>
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